LEXFLEX develop it's own technology on manufacturing 2L FCCL adhesiveless flexible copper clad laminates and Metal Mash Film for Touch Applications. With it's leading technology, which gives LEXFLEX with outstanding performance for electronic products become flexable and thin as before.

Our Sputtering Equipment

Breakthrough FCCL

Structure of 2L FCCL without adhesive layer. More design freedom in flexing applications!

Innovations with Sputtering Technology

2L-FCCL is an Ultra Thin Adhesiveless flex made by "Sputtering Technology", providing superior performance and low-cost advantages. Electroplating-positon of the required thickness on sputter pre-metalized polyimide film in a roll to roll process is a cost effective method to produce the LEXFLEX 2L-FCCL in customized copper thickness ranging from 1µm to 12µm. LEXFLEX 2L-FCCL is widely used on high tech consumer electronic products, such as Smart Chip Cards, SIM Card, Circuit Board of RFID, E-paper, Chip On Film (COF), Mobile Phone and Organic Solar Battery’ Soft Electronic Board.